heating and static switching. industrial and domestic lighting, applications include motor control, voltage capability and high thermal cycling performance. typical i general description sot-223 bt134w series glass passivated triacs in a plastic symbol parameter max. max. max. unit envelope suitable for surface mounting, intended for use in bt134w- 500 600 800 applications requiring high bt134w- 500f 600f 800f bidirectional transient and blocking bt134w- 500g 600g 800g drm repetitive peak off-state 500 600 800 v t(rms) rms on-state current 1 1 1 a tsm non-repetitive peak on-state 10 10 10 a limiting values limiting values in accordance with the absolute maximum system (iec 134). symbol parameter conditions min. max. unit -500 -600 -800 v drm repetitive peak off-state - 500 1 600 1 800 v voltages i t(rms) rms on-state current full sine wave; t sp 108 ?c - 1 a i tsm non-repetitive peak full sine wave; t j = 25 ?c prior to on-state current surge t = 20 ms - 10 a t = 16.7 ms - 11 a i 2 ti 2 t for fusing t = 10 ms - 0.5 a 2 s di t /dt repetitive rate of rise of i tm = 1.5 a; i g = 0.2 a; on-state current after di g /dt = 0.2 a/ m s triggering t2+ g+ - 50 a/ m s t2+ g- - 50 a/ m s t2- g- - 50 a/ m s t2- g+ - 10 a/ m s i gm peak gate current - 2 a v gm peak gate voltage - 5 v p gm peak gate power - 5 w p g(av) average gate power over any 20 ms period - 0.5 w t stg storage temperature -40 150 ?c t j operating junction - 125 ?c temperature t1 t2 g 1 although not recommended, off-state voltages up to 800v may be applied without damage, but the triac may switch to the on-state. the rate of rise of current should not exceed 3 a/ m s. quick reference data symbol voltages current v i 2014-6-15 www.kersemi.com 1
2 thermal resistances symbol parameter conditions min. typ. max. unit r th j-sp thermal resistance full or half cycle - - 15 k/w junction to solder point r th j-a thermal resistance pcb mounted; minimum footprint - 156 - k/w junction to ambient pcb mounted; pad area as in fig:14 - 70 - k/w static characteristics t j = 25 ?c unless otherwise stated symbol parameter conditions min. typ. max. unit bt134w- ... ...f ...g i gt gate trigger current v d = 12 v; i t = 0.1 a t2+ g+ - 5 35 25 50 ma t2+ g- - 8 35 25 50 ma t2- g- - 11 35 25 50 ma t2- g+ - 30 70 70 100 ma i l latching current v d = 12 v; i gt = 0.1 a t2+ g+ - 7 20 20 30 ma t2+ g- - 16 30 30 45 ma t2- g- - 5 20 20 30 ma t2- g+ - 7 30 30 45 ma i h holding current v d = 12 v; i gt = 0.1 a - 5 15 15 30 ma v t on-state voltage i t = 2 a - 1.2 1.50 v v gt gate trigger voltage v d = 12 v; i t = 0.1 a - 0.7 1.5 v v d = 400 v; i t = 0.1 a; 0.25 0.4 - v t j = 125 ?c i d off-state leakage current v d = v drm(max) ; - 0.1 0.5 ma t j = 125 ?c dynamic characteristics t j = 25 ?c unless otherwise stated symbol parameter conditions min. typ. max. unit bt134w- ... ...f ...g dv d /dt critical rate of rise of v dm =67% v drm(max) ; 100 50 200 250 - v/ m s off-state voltage t j = 125 ?c; exponential waveform; gate open circuit dv com /dt critical rate of change of v dm = 400 v; t j = 95 ?c; - - 10 50 - v/ m s commutating voltage i t(rms) = 1 a; di com /dt = 1.8 a/ms; gate open circuit t gt gate controlled turn-on i tm = 1.5 a; - - - 2 - m s time v d = v drm(max) ; i g = 0.1 a; di g /dt = 5 a/ m s; bt134w series 2014-6-15 www.kersemi.com
3 fig.1. maximum on-state dissipation, p tot , versus rms on-state current, i t(rms) , where a = conduction angle. fig.2. maximum permissible non-repetitive peak on-state current i tsm , versus pulse width t p , for sinusoidal currents, t p 20ms. fig.3. maximum permissible non-repetitive peak on-state current i tsm , versus number of cycles, for sinusoidal currents, f = 50 hz. fig.4. maximum permissible rms current i t(rms) , versus solder point temperature t sp . fig.5. maximum permissible repetitive rms on-state current i t(rms) , versus surge duration, for sinusoidal currents, f = 50 hz; t sp 108?c. fig.6. normalised gate trigger voltage v gt (t j )/ v gt (25?c), versus junction temperature t j . 0 0.2 0.4 0.6 0.8 1 1.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 = 180 120 90 60 30 bt134w it(rms) / a ptot / w tsp(max) / c 125 122 119 116 113 110 107 104 1 -50 0 50 100 150 0 0.2 0.4 0.6 0.8 1 1.2 bt134w tsp / c it(rms) / a 108 c 1 10 100 1000 bt134w t / s itsm / a 10us 100us 1ms 10ms 100ms t i tsm time i tj initial = 25 c max t di /dt limit t t2- g+ quadrant 0.01 0.1 1 10 0 0.5 1 1.5 2 bt134w surge duration / s it(rms) / a 1 10 100 1000 0 2 4 6 8 10 12 bt134w number of cycles at 50hz itsm / a t i tsm time i tj initial = 25 c max t -50 0 50 100 150 0.4 0.6 0.8 1 1.2 1.4 1.6 bt136 tj / c vgt(tj) vgt(25 c) bt134w series 2014-6-15 www.kersemi.com
4 fig.7. normalised gate trigger current i gt (t j )/ i gt (25?c), versus junction temperature t j . fig.8. normalised latching current i l (t j )/ i l (25?c), versus junction temperature t j . fig.9. normalised holding current i h (t j )/ i h (25?c), versus junction temperature t j . fig.10. typical and maximum on-state characteristic. fig.11. transient thermal impedance z th j-sp , versus pulse width t p . fig.12. typical commutation dv/dt versus junction temperature, parameter commutation di t /dt. the triac should commutate when the dv/dt is below the value on the appropriate curve for pre-commutation di t /dt. -50 0 50 100 150 0 0.5 1 1.5 2 2.5 3 bt136 tj / c t2+ g+ t2+ g- t2- g- t2- g+ igt(tj) igt(25 c) 0 0.5 1 1.5 2 0 0.5 1 1.5 2 bt134w vt / v it / a tj = 125 c typ max tj = 25 c vo = 1.0 v rs = 0.21 ohms -50 0 50 100 150 0 0.5 1 1.5 2 2.5 3 triac tj / c il(tj) il(25 c) 10us 0.1ms 1ms 10ms 0.1s 1s 10s tp / s 0.01 0.1 1 10 zth j-sp (k/w) 100 t p p t d unidirectional bidirectional bt134w -50 0 50 100 150 0 0.5 1 1.5 2 2.5 3 triac tj / c ih(tj) ih(25c) 0 50 100 150 1 10 100 1000 1.8 3 tj / c dicom/dt = 5.1 3.9 2.3 dvcom/dt (v/us) a/ms 1.4 off-state dv/dt limit bt134...g series bt134 series bt134...f series bt134w series 2014-6-15 www.kersemi.com
5 mounting instructions dimensions in mm. fig.13. soldering pattern for surface mounting sot223. printed circuit board dimensions in mm. fig.14. pcb for thermal resistance and power rating for sot223. pcb: fr4 epoxy glass (1.6 mm thick), copper laminate (35 m m thick). 3.8 min 6.3 2.3 4.6 1.5 min 1.5 min 1.5 min (3x) 36 60 9 10 4.6 18 4.5 7 15 50 bt134w series 2014-6-15 www.kersemi.com
6 mechanical data dimensions in mm net mass: 0.11 g fig.15. sot223 surface mounting package. notes 1. for further information, refer to philips publication sc18 " smd footprint design and soldering guidelines". order code: 9397 750 00505. 2. epoxy meets ul94 v0 at 1/8". 6.7 6.3 3.1 2.9 4 1 23 2.3 1.05 0.85 0.80 0.60 4.6 3.7 3.3 7.3 6.7 b a 0.10 0.02 13 16 max 1.8 max 10 max 0.32 0.24 (4x) b m 0.1 a m 0.2 bt134w series 2014-6-15 www.kersemi.com
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